ELECTRONIC CHIP DEVICE AND METHOD OF MANUFACTURING BY COILS
摘要
<p>The invention consists of an electronic chip device (0) comprising at least a flexible support film (3) whose upper surface has an upper contact pad (5) and whose lower surface has at least one lower contact pad (72), each contact pad being connected by interconnection (4) through the support film (3) in such a way that at least one lower contact pad (72) is connected to a used upper contact pad (51), where the lower contact pads (72) are in the area facing the unused upper contact pad (50). A thick film provided with at least one cavity is fixed to at least one part of the surface of the support film (3). The invention also consists of the method and machine for manufacturing the device (0).</p>
