| 摘要 |
PURPOSE: A chip interval maintaining method is provided to maintain an interval between chips by attaching tape to a device wafer not parallel to a division line of the device wafer in a tension direction of the tape. CONSTITUTION: A device is formed in each region of a device wafer(11) which is divided by a plurality of division lines(13). Tape(4) is contracted by heating by a preset temperature and is attached to the rear of the device wafer. A division start point is formed along the division line of the device wafer. A plurality of chips is formed by dividing the device wafer along the division line. An interval between chips is maintained by contracting the tape by heating a space between the inside of a ring-shaped frame and the outside of the device wafer.
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