| 摘要 |
PURPOSE: A wafer and a processing method thereof are provided to improve a profile of the wafer by removing the edges of a groove with pressure applied to a pad in a double side polishing process. CONSTITUTION: A wafer(100) includes a central active region and a peripheral region(110). A plurality of grooves(121,122) are formed in the peripheral region of the wafer. The groove includes a first region of a central part and a second region of a peripheral part which are etched from the surface with a preset depth. A step structure with a first bottom surface(121a) and a second bottom surface(121c) is formed by etching a preset part of the peripheral region of the wafer twice. A first incline surface(121b) and a second incline surface(121d) are inclined to the bottom surface at 30 to 60 degrees.
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