| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a stable and reliable electroless metal plating catalyst which is applied to a resin laminated substrate used in the manufacture of printed circuit board, in particular, to a through-hole formed on a substrate. <P>SOLUTION: A catalyst includes an aqueous solution containing one or more antioxidents, nanoparticles of metal chosen from silver, gold, platinum, iridium, copper, aluminum, cobalt, nickel and iron, and cellulose or cellulose derivatives, and being free of tin. <P>COPYRIGHT: (C)2013,JPO&INPIT |
