| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technology which improves cooling efficiency in a cooling device of a power module. <P>SOLUTION: The specification discloses a cooling device cooling a power module. The cooling device includes a first cooling member enabling the power module to be disposed on its outer surface contacting tightly therewith and a second cooling member. In the cooling device, a refrigerant passage is formed between an inner surface of the first cooling member and an inner surface of the second cooling member. In the cooling device, a partition wall, which divides the refrigerant passage on the upstream side from the refrigerant passage on the downstream side, extends from the inner surface of the second cooling member to the first cooling member. In the cooling device, a fin extends from the inner surface of the first cooling member to the second cooling member. <P>COPYRIGHT: (C)2013,JPO&INPIT |
