| 摘要 |
Provided is a module substrate wherein an insulating resin top surface sag in the vicinity of the center of a substrate can be suppressed by disposing a plurality of columnar connecting terminals not only on a circumferential end portion of the substrate but also among a plurality of electronic components mounted on the substrate. A plurality of electronic components (4, 4h) are mounted on one surface of a substrate (5), and are sealed using an insulating resin (3). A plurality of columnar connecting terminals (2, 7) are disposed on a circumferential end portion of the substrate (5) and/or on one or a plurality of small regions (8), and the one or a plurality of the small regions (8) are set at positions where the electronic components (4, 4h) are not mounted, said positions being on the substrate (5), excluding the circumferential portion of the substrate (5). |
