| 发明名称 |
BARRIER LAYER DIELECTRIC FOR RFID CIRCUITS |
| 摘要 |
<p>This invention is directed to a polymer thick film barrier layer dielectric composition. Dielectrics made from the composition can be used in various electronic applications to protect electrical elements and particularly to insulate and protect both the conductive silver antenna above it and the polycarbonate substrate below it in RFID applications.</p> |
| 申请公布号 |
WO2013036369(A1) |
申请公布日期 |
2013.03.14 |
| 申请号 |
WO2012US51407 |
申请日期 |
2012.08.17 |
| 申请人 |
E. I. DU PONT DE NEMOURS AND COMPANY;ARANCIO, VINCE;DORFMAN, JAY ROBERT |
发明人 |
ARANCIO, VINCE;DORFMAN, JAY ROBERT |
| 分类号 |
H01Q1/22;C08G18/08;C09J175/00;G06K19/077;H05K3/12 |
主分类号 |
H01Q1/22 |
| 代理机构 |
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