CLAY COMPOSITION FOR FORMING SILVER-COPPER ALLOY SINTERED COMPACT, POWDER FOR THE CLAY COMPOSITION FOR FORMING SILVER-COPPER ALLOY SINTERED COMPACT, METHOD FOR PRODUCING THE CLAY COMPOSITION FOR FORMING SILVER-COPPER ALLOY SINTERED COMPACT, METHOD FOR PRODUCING SILVER-COPPER ALLOY SINTERED COMPACT, AND THE SILVER-COPPER ALLOY SINTERED COMPACT

摘要

PROBLEM TO BE SOLVED: To provide a silver-copper alloy sintered compact produced from a clay composition for forming the silver-copper alloy sintered compact capable of forming the silver-copper alloy sintered compact which is not easily discolored even in an air atmosphere and has excellent tensile strength, bending strength, surface hardness, and elongation etc., and a method for producing the silver-copper alloy sintered compact.

SOLUTION: The clay composition for forming the silver-copper alloy sintered compact comprises: a powder component containing silver-containing powder and oxygen-containing powder; a binder; and water; wherein, in the oxygen-containing copper powder, pure Cu is present at the central part of each particle, while copper oxide is formed at the surface layer part of the pure Cu, and further, the ratio of the pure Cu to the whole of the oxygen-containing copper powder lies in the range of 0.7 to 80 mass%, and the total of the copper oxide is controlled to ≥20 mass% to the whole of the oxygen-containing copper powder. The clay composition for forming the silver-copper alloy sintered compact is fired to solve the problems.

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