MODULE MANUFACTURING METHOD AND MODULE

摘要

The present invention relates to a method by which a module may be manufactured at a low cost and within a short period of time and an inter-layer connection conductor may be formed without having to form a via hole by mounting an approximately T-shaped connecting terminal on a wiring substrate. A module (100) of the present invention is manufactured by mounting and resin-sealing an electronic component (102) and a column-shaped connecting terminal (11) forming the inter-layer connection conductor on a wiring substrate (101). The method of the present invention comprises preparing the column-shaped connecting terminal (11) which comprises the approximately T-shaped connecting terminal whose diameter at one end is longer than the diameter at the other end (preparing process), mounting the electronic component (102) at one circumferential surface of the wiring substrate (101) and mounting the connecting terminal (11) to connect the other end of a small diameter side of the connecting terminal (11) to the wiring substrate (101) (mounting process), and sealing the electronic component (102) and the connecting terminal (11) by using a resin layer (103) (sealing process). According to the present invention, the module (100) comprising the inter-layer connection conductor may be manufactured at a low cost and within a short period of time.