APPARATUS AND METHOD OF GRIDING WAFER EDGE

摘要

PURPOSE: An apparatus and method for polishing a wafer edge are provided to reduce process time by easily determining the process state of the wafer edge based on a load of a rotary driving unit. CONSTITUTION: A wafer is fixed to a chuck(S10). The wafer is rotated(S20). A wafer edge is grinded(S30). The amount of loads of a rotary driving unit is measured(S40). The process state of the wafer edge is determined based on the amount of loads of the rotary driving unit(S50). [Reference numerals] (S10) Fixing a wafer to a chuck; (S20) Rotating the wafer; (S30) Grinding a wafer edge; (S40) Measuring the amount of loads of a motor; (S50) Determining the process state of the wafer edge