| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a structure of a flow sensor that seals part of a semiconductor device and the surface of an electric control circuit with resin, by using a method for manufacture in which burr generation or breakage of the semiconductor device caused by clamping in a die is prevented. <P>SOLUTION: The structure of an air flow sensor is used, which includes a semiconductor device in which an air flow rate detection unit and a diaphragm are formed, and a substrate or a lead frame on which an electric control circuit for controlling the semiconductor device is arranged, and in which the surface of the electric control circuit is covered with a resin, including part of the surface of the semiconductor device with the air flow rate detection unit exposed. This invention relates to the structure of the flow sensor enclosing the semiconductor device while each surface of a resin mold, the substrate or a pre-mold component molded beforehand is out of contact continuously with three surfaces perpendicular to an installation surface of the air flow rate detection unit of the semiconductor device, and to the method for manufacture capable of absorbing size dispersion of the semiconductor device by deformation of a spring or deformation in the thickness direction of an elastic body film. <P>COPYRIGHT: (C)2013,JPO&INPIT |
