发明名称 DESIGN METHOD OF WIRING LAYOUT, SEMICONDUCTOR DEVICE, PROGRAM FOR SUPPORTING DESIGN OF WIRING LAYOUT, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 According to one embodiment, a design method of layout formed by a sidewall method is provided. The method includes: preparing a base pattern on which a plurality of first patterns extending in a first direction and arranged at a first space in a second direction intersecting the first direction and a plurality of second patterns extending in the first direction and arranged at a center between the first patterns, respectively, are provided; and drawing a connecting portion which extends in the second direction and connects two neighboring first patterns sandwiching one of the second patterns, and separating the one of the second patterns into two patterns not contacting the connecting portion.
申请公布号 US2013062771(A1) 申请公布日期 2013.03.14
申请号 US201213405922 申请日期 2012.02.27
申请人 KODAMA CHIKAAKI;NAKAYAMA KOICHI;KOTANI TOSHIYA;NOJIMA SHIGEKI;KABUSHIKI KAISHA TOSHIBA 发明人 KODAMA CHIKAAKI;NAKAYAMA KOICHI;KOTANI TOSHIYA;NOJIMA SHIGEKI
分类号 H01L23/48;G06F17/50;H01L21/311 主分类号 H01L23/48
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