发明名称 LIQUID TREATMENT APPARATUS FOR SUBSTRATE, AND METHOD FOR CONTROLLING LIQUID TREATMENT APPARATUS FOR SUBSTRATE
摘要 <p>This liquid treatment apparatus for a substrate has: a rotating plate (23P), which is rotated by means of a rotary drive unit; substrate supporting units (51), each of which extends along the circumferential end of the rotating plate (23P) and support the circumferential end of the substrate; guide units (52), each of which is provided on an upper end of each of the substrate supporting units (51), and guides the substrate to each of the substrate supporting units (51); and a supply unit (24B), which supplies a liquid to the substrate from above, said substrate having the circumferential end thereof supported by means of the substrate supporting units (51). At least three guide units (52) are provided in the circumferential direction of the rotating plate (23P), and have a height higher than the surface of the substrate having the circumferential end thereof supported by means of the substrate supporting units (51).</p>
申请公布号 WO2013035731(A1) 申请公布日期 2013.03.14
申请号 WO2012JP72586 申请日期 2012.09.05
申请人 TOKYO ELECTRON LIMITED;MOURI NOBUHIKO;HIDAKA SHOICHIRO 发明人 MOURI NOBUHIKO;HIDAKA SHOICHIRO
分类号 H01L21/304;G03F7/20;H01L21/027 主分类号 H01L21/304
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