| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic device manufacturing method, capable of reducing a gap between a high potential-side conductor and a low potential-side conductor formed to be juxtaposed from one conductor plate. <P>SOLUTION: By the preparation of one conductor plate 30, the electronic device manufacturing method includes: juxtaposing each conductor 31 and each conductor 32 between an edge portion 31a and an edge portion 32a to form a gap d before adjustment; processing the conductor plate 30 in a manner to connect between each conductor through connection portions 51, 52 etc; by deforming the center portion 52a of the connection portion 52, narrowing the gap d before adjustment; and after sealing each mounted switch, each conductor, etc. with a mold resin, removing the connection by the connection portions 51, 52, etc., to mold a power conversion circuit. <P>COPYRIGHT: (C)2013,JPO&INPIT |
