PLATING CURRENT DENSITY DISTRIBUTION MEASUREMENT DEVICE AND PLATING CURRENT DENSITY DISTRIBUTION MEASUREMENT METHOD

摘要

A plating current density distribution measurement device is provided as a device that achieves an accurate measurement of the in-plane distribution of a plating current density in a cathode plate. The plating current density distribution measurement device comprises: a plating bath; an anode and a member to be plated that are at least partially disposed under the surface of a plating solution contained in the plating bath; a first current measuring body comprising a first insulator and a first measurement electrode formed on one surface of the first insulator and disposed so that the first insulator faces a part of the surface to be plated of the member to be plated; a plating power supply; a first interconnection for electrically connecting an anode terminal of the plating power supply to the anode; a second interconnection for electrically connecting a cathode terminal of the plating power supply to the member to be plated; a third interconnection for electrically connecting the cathode terminal of the plating power supply to the first measurement electrode so that the first measurement electrode and the member to be plated form a parallel relationship; and a first current measurement device disposed in the third interconnection.