| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a through wiring board which inhibits stress applied to a conductive layer formed in a through hole and facilitates effective heat radiation from the conductive layer, and to provide a manufacturing method of the through wiring board. <P>SOLUTION: A through wiring substrate 10 includes: an electrode layer 12 disposed on one surface 11a of a semiconductor substrate 11 (substrate); a through hole 20 opened in the semiconductor substrate 11 so that at least a part of the electrode layer 12 is exposed; a first insulation layer 15 covering an inner side surface 20a of the through hole 20 and disposed so that at least the part of the electrode layer 12 is exposed; a conductive layer 5 which is disposed so as to cover the inner side surface 20a of the through hole 20 and an exposed part of the electrode layer 12 through the first insulation layer 15 and electrically connects with the electrode layer 12; and a second insulation layer 16 disposed so as to cover the conductive layer 5. The second insulation layer 16 is formed along a surface shape of the conductive layer 5. <P>COPYRIGHT: (C)2013,JPO&INPIT |
