| 发明名称 |
METHOD FOR PRODUCING A CAPPING WAFER FOR A SENSOR |
| 摘要 |
A method for producing a capping wafer for a sensor having at least one cap includes: production of a contacting via extending through the wafer, and, temporally subsequent thereto, filling of the contacting via with an electrically conductive material. |
| 申请公布号 |
US2013061674(A1) |
申请公布日期 |
2013.03.14 |
| 申请号 |
US201213670716 |
申请日期 |
2012.11.07 |
| 申请人 |
ROBERT BOSCH GMBH;ROBERT BOSCH GMBH |
发明人 |
REICHENBACH FRANK;LAERMER FRANZ;KRONMUELLER SILVIA;SCHEURLE ANDREAS |
| 分类号 |
H05K1/03;G01P15/125;H05K1/11 |
主分类号 |
H05K1/03 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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