SEMICONDUCTOR PACKAGE SUBSTRATE INCLUDING DUMMY REGION

摘要

PURPOSE: A semiconductor package substrate including a dummy region is provided to prevent the warpage of the semiconductor package substrate due to a gap between copper patterns arranged in a dummy region. CONSTITUTION: A semiconductor package substrate(400) includes a package region(410) and a dummy region(420). The dummy region surrounds the package region. The dummy region includes a copper pattern unit. The copper pattern unit is composed of a plurality of copper blocks(430). The copper block is divided into copper blocks of a first group and copper blocks of a second group. The copper blocks of the first group are arranged on the upper and lower sides of the package regions in a vertical direction of the semiconductor package substrate. The copper blocks of the second group are arranged in a transverse direction of the semiconductor package substrate between the package regions.