| 摘要 |
1,201,676. Semiconductor devices. CKD PRAHA OBOROVY PODNIK. 20 March, 1968 [25 March, 1967], No. 13384/68. Heading H1K. A casing for a semi-conductor device 1 comrises two copper main electrode plates 2 and 3 in intimate sliding engagement with the device connected by two frames 4 and 5 of injection moulded synthetic resin, preassembled with the electrode plates and held together by a ring 14 of synthetic resin injection moulded around their outer edges. The thin-walled parts 6 and 7 give flexibility to the casing to permit good connections between the plates and the contact faces of the device at all times. A seal ring 9 of tetrafluoroethylene is provided, where it lies between the electrodes, with concentric grooves 10. A conductor 11 can pass through a bushing 13. In use, the device is clamped between two heat sinks and compressed by a clamp bolt. |
