| 摘要 |
A substrate heating apparatus (20) includes a container configured to be maintained in a depressurized state; and a substrate mounting table (86) having a plurality of substrate support pins on its upper surface. The substrate mounting table (86) is configured to mount a substrate while providing a gap between the upper surface of the substrate mounting table (86) and the substrate. The substrate heating apparatus (20) further includes a heater (87) configured to heat the substrate through the substrate mounting table (86); a pressure regulator configured to regulate a pressure in the container; a temperature controller configured to control an output of the heater so as to control a temperature of the substrate mounting table; and a pressure controller configured to control the pressure regulator so as to control the pressure in the container. |
