发明名称 |
A MEMS airflow sensor die incorporating additional circuitry on the die |
摘要 |
A MEMS airflow sensor die having a heater control circuit, differential instrumentation amplifier, temperature compensation, and/or offset correction circuitry integrated with an airflow sensor on the MEMS die. The added circuitry may be placed on space available on the basic airflow die with MEMS fabrication techniques without enlarging the sensor die. The die with the added circuitry may result in a device having a reduced form factor, improved reliability and lower cost. |
申请公布号 |
EP2568264(A1) |
申请公布日期 |
2013.03.13 |
申请号 |
EP20120182466 |
申请日期 |
2012.08.30 |
申请人 |
HONEYWELL INTERNATIONAL INC. |
发明人 |
QASIMI, MOHAMMED ABDUL JAVVAD;RICKS, LAMAR FLOYD |
分类号 |
G01F1/684;G01F1/692;G01F1/698;G01F15/02 |
主分类号 |
G01F1/684 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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