| 摘要 |
1,204,619. Encapsulating by injection moulding. RCA CORPORATION. 26 April, 1968 [26 April, 1967], No. 19856/68. Heading B5A. [Also in Division H1] The leads 12, 13 and support 22 for an integrated circuit or other semi-conductor device are formed as inward extensions from a frame 20, the inner ends of these leads being wired to contacts on the device (as shown) or being directly bonded to the contacts. The lead assembly with the attached semiconductor device is placed between the two halves of a mould (18), Fig. 3 (not shown), and is located by pins (42) which pass through the apertures 46. Silicone or epoxy resin is injected to fill the cavity in the mould and form body 10-the halves of the mould are held apart by the lead assembly and to prevent excessive escape of resin between the leads these are linked near their inner ends by portions 28, 28<SP>1</SP> to block the flow of resin which forms the flashes 60. The frame and linking portions 28, 28<SP>1</SP> are then trimmed away, the flashes 60 also being removed if desired. |
