PURPOSE: A collet assembly for attaching a semiconductor die is provided to reduce interruption time by inserting a collet axis to a collet axis adapter to simply fix the collet without a screw. CONSTITUTION: A collet(130) absorbs a semiconductor die under vacuum and transfers the semiconductor die to the upper side of a package substrate. The collet is fixed to the lower side of a collet axis(110). A collet axis adapter(120) is combined with the upper side of the collet axis. The collet axis adapter includes a top adapter(124) and a bottom adapter(122). A magnetic member(140) fixes the collet axis to the collet axis adapter with a magnetic force. The magnetic member includes a first magnetic element(142) arranged in the collet axis and a second magnetic element(144) received in the collet axis adapter.
