发明名称
摘要 <P>PROBLEM TO BE SOLVED: To provide a vacuum treatment apparatus capable of measuring the impedance of plasma. <P>SOLUTION: A measurement chamber 12 is connected to a vacuum tank 11, and probes 31 and 32 are disposed in the measurement chamber 12. The vacuum tank 11 is provided with a plurality of plasma generating devices 16, a shutter 35 between the vacuum tank 11 and measurement chamber 12 is opened, one plasma generating device 16 is selected and applied with a high-frequency voltage to generate plasma in the vacuum tank 11, and while the generated plasma is used as a load, measurement signals are applied from the probes 31 and 32 to determine the impedance of the plasma. Impedance matching can be performed by plasma generating devices 16. When a vacuum treatment is carried out, the shutter 35 can be held closed, and the probes 31 and 32 are not damaged by plasma of a treating gas such as an etching gas. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP5162269(B2) 申请公布日期 2013.03.13
申请号 JP20080029535 申请日期 2008.02.08
申请人 发明人
分类号 H01L21/3065;C23C16/52;H01L21/205;H01L21/31;H05H1/00;H05H1/46 主分类号 H01L21/3065
代理机构 代理人
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