| 发明名称 |
Semiconductor device including cladded base plate |
| 摘要 |
<p>A semiconductor device includes a semiconductor chip coupled to a substrate and a base plate coupled to the substrate. The base plate includes a first metal layer clad to a second metal layer. The second metal layer is deformed to provide a pin-fin or fin cooling structure.</p> |
| 申请公布号 |
SE1251008(A1) |
申请公布日期 |
2013.03.13 |
| 申请号 |
SE20120051008 |
申请日期 |
2012.09.10 |
| 申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
OLAF HOHLFELD;ANDREAS LENNIGER;ANDREAS UHLEMANN |
| 分类号 |
H01L23/367;H01L23/373 |
主分类号 |
H01L23/367 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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