| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To enhance the connection reliability of a solder bump by preventing occurrence of voids in an underfill resin which is filled in a gap between a circuit substrate, and to provide a semiconductor element. Ž<P>SOLUTION: First, a semiconductor element 102 is mounted to the surface of a circuit board 101. Next, a gap between the circuit substrate 101 and the semiconductor element 102 is filled with an underfill resin having fluidity. Then, the underfill resin filled into the gap between the board 101 and the element 102 is cured. Here, when the gap between the circuit board 101 and the semiconductor element 102 is filled with the underfill resin, the underfill resin is supplied to the gap between the board 101 and the element 102, from a plurality of positions opposite to the side surface of the semiconductor element 102. Ž<P>COPYRIGHT: (C)2009,JPO&INPIT Ž</p> |
