| 摘要 |
An IC system includes one or more low-power chips 102, e.g., memory chips, located proximate one or more higher power chips 101, e.g., logic chips, without suffering the effects of overheating. The IC system includes a high-power chip disposed on a packaging substrate 110 and a low-power chip embedded in the packaging substrate to form a stack. Because portions of the packaging substrate thermally insulate the low-power chip from the high-power chip, the low-power chip can be embedded in the IC system in close proximity to the high-power chip without being overheated by the high-power chip. Such close proximity between the low-power chip and the high-power chip advantageously shortens the path length of interconnects therebetween, which improves device performance and reduces interconnect parasitics in the IC system. An interposer (350, figure 3) may be provided on which the high-power chip and other external chips may be disposed. |
