发明名称 METHOD FOR PARTIALLY STRIPPING A DEFINED AREA OF A CONDUCTIVE LAYER
摘要 A method for partial detachment of a defined area of a conductive layer using a laser beam includes forming a conductor track with a defined path from the conductive layer on the substrate, the path defining main axes. The area is segmented into zones. A linear recess is provided along a respective perimeter of each of the zones. Each of the zones has a strip shape such that the recesses extend along paths that are substantially straight lines not parallel to either of the main axes. One of the zones to be removed is heated using laser radiation until adhesion of the conductive layer to the substrate is substantially reduced and the zone to be removed is detached in a surface-wide manner from the substrate under external influences. Laser-beam parameters are set such that only the conductive layer is removed without affecting an underlying substrate.
申请公布号 EP2567601(A1) 申请公布日期 2013.03.13
申请号 EP20110723862 申请日期 2011.03.23
申请人 LPKF LASER & ELECTRONICS AG 发明人 VAN AALST, JAN;KOVACIC, DRAGO;PODOBNIK, BOSTJAN
分类号 H05K3/02;B23K26/36 主分类号 H05K3/02
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