| 摘要 |
PURPOSE: A substrate polishing device is provided to improve compatibility by simply performing lapping to replace a bottom plate and/or a top plate. CONSTITUTION: A bottom plate(20) rotates with a shaft which is perpendicular to a main body(10) as the center. A bottom plate driving part provides torque to the bottom plate. A top plate is settled on a polishing target substrate. A carrier(40) with a ring shape is combined on the exterior of the top plate. Gear teeth are formed on the exterior of the carrier with the ring shape. A driving guide roller(51) and a following guide roller(52) rotate the carrier with the ring shape. A weight block(60) provides pressure to the top plate downwards. |
