发明名称 Method for manufacturing substrate for semiconductor light emitting element and semiconductor light emitting element using the same
摘要 A light emitting element having a recess-protrusion structure on a substrate is provided. A semiconductor light emitting element 100 has a light emitting structure of a semiconductor 20 on a first main surface of a substrate 10. The first main surface of the substrate 10 has substrate protrusion portion 11, the bottom surface 14 of each protrusion is wider than the top surface 13 thereof in a cross-section, or the top surface 13 is included in the bottom surface 14 in a top view of the substrate. The bottom surface 14 has an approximately polygonal shape, and the top surface 13 has an approximately circular or polygonal shape with more sides than that of the bottom surface 14.
申请公布号 US8394652(B2) 申请公布日期 2013.03.12
申请号 US20100816186 申请日期 2010.06.15
申请人 MINATO SHUNSUKE;NARITA JUNYA;WAKAI YOHEI;NARUKAWA YUKIO;YAMADA MOTOKAZU;NICHIA CORPORATION 发明人 MINATO SHUNSUKE;NARITA JUNYA;WAKAI YOHEI;NARUKAWA YUKIO;YAMADA MOTOKAZU
分类号 H01L21/00;H01L33/22;H01L33/32;H01L33/60;H01L33/62 主分类号 H01L21/00
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