发明名称 Method of manufacturing semiconductor device, and semiconductor device
摘要 A semiconductor device including a substrate, and an insulating film formed over the substrate, wherein the insulating film has a first contact having a rectangular geometry in a plan view, and second to fifth contacts provided respectively adjacent to the individual edges of the rectangular first contact, formed therein.
申请公布号 US8395238(B2) 申请公布日期 2013.03.12
申请号 US20110929664 申请日期 2011.02.07
申请人 KONISHI KOUICHI;RENESAS ELECTRONICS CORPORATION 发明人 KONISHI KOUICHI
分类号 H01L21/00 主分类号 H01L21/00
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