发明名称 Electrothermal transfer device and electrothermal transfer method
摘要 An electrothermal transfer device includes a substrate, a plurality of electrothermal components and a heating circuit. The electrothermal components are disposed on a surface of the substrate and arranged in a pattern. The heating circuit is electrically connected to the electrothermal components. In an electrothermal transfer method, at first, a transfer substrate is disposed on a workpiece substrate. Then, the electrothermal transfer device is disposed on the transfer substrate so that the electrothermal components contact with the transfer substrate. Thereafter, the heating circuit is used to heat the electrothermal transfer components so that the transfer substrate is heated to be transferred to the workpiece substrate. The electrothermal transfer device and the electrothermal transfer method can reduce cost.
申请公布号 US8395095(B2) 申请公布日期 2013.03.12
申请号 US201113090773 申请日期 2011.04.20
申请人 YEH CHIA-CHUN;TSAI YAO-CHOU;WANG HENRY;HUANG SUNG-HUI;E INK HOLDINGS INC. 发明人 YEH CHIA-CHUN;TSAI YAO-CHOU;WANG HENRY;HUANG SUNG-HUI
分类号 H05B3/02;H05B1/00 主分类号 H05B3/02
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