发明名称 Molding windows in thin pads
摘要 A polishing pad includes a polishing layer having a polishing surface, an adhesive layer on a side of the polishing layer opposite the polishing layer, and a solid light-transmitting window extending through and molded to the polishing layer. The solid light-transmitting window has an upper portion with a first lateral dimension and a lower portion with a second lateral dimension that is smaller than the first lateral dimension. A top surface of the solid light-transmitting window coplanar with the polishing surface and a bottom surface of the solid light-transmitting window coplanar with a lower surface of the adhesive layer.
申请公布号 US8393940(B2) 申请公布日期 2013.03.12
申请号 US20100762175 申请日期 2010.04.16
申请人 SWEDEK BOGUSLAW A;BENNETT DOYLE E;BENVEGNU DOMINIC J;APPLIED MATERIALS, INC. 发明人 SWEDEK BOGUSLAW A;BENNETT DOYLE E;BENVEGNU DOMINIC J
分类号 B24D11/00 主分类号 B24D11/00
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