发明名称 |
Light emitting device, light emitting device package, method of manufacturing light emitting device and illumination system |
摘要 |
A light emitting device according to the embodiment includes a substrate; a protective layer on the substrate; a electrode layer on the protective layer; a light emitting structure disposed on the electrode layer to generate light and provided with a first semiconductor layer, an active layer under the first semiconductor layer, and a second conductive semiconductor layer under the active layer; and a first electrode having a first end disposed on a top surface of the light emitting structure and a second end disposed on the protective layer. The protective layer comes into Schottky contact with at least one of the electrode layer and the first electrode.
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申请公布号 |
US8395182(B2) |
申请公布日期 |
2013.03.12 |
申请号 |
US201113030600 |
申请日期 |
2011.02.18 |
申请人 |
JEONG HWAN HEE;LEE SANG YOUL;MOON JI HYUNG;SONG JUNE O;CHOI KWANG KI;LG INNOTEK CO., LTD. |
发明人 |
JEONG HWAN HEE;LEE SANG YOUL;MOON JI HYUNG;SONG JUNE O;CHOI KWANG KI |
分类号 |
H01L33/00 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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