发明名称 Method for disposing a component
摘要 In order to increase the probability that the component is disposed on the hydrophilic region, used is a substrate comprises a water-repellant region, a hydrophilic region, and a hydrophilic line, wherein the water-repellant region surrounds the hydrophilic region and the hydrophilic line, the hydrophilic region and the hydrophilic line are disposed along the +X direction in this order, the value of D1/D2 is not less than 0.1 and not more than 1.2, the value of D3 is not less than 5 micrometers, the value of D4 is less than the minimum length of the component.
申请公布号 US8394458(B2) 申请公布日期 2013.03.12
申请号 US201213453629 申请日期 2012.04.23
申请人 ARASE HIDEKAZU;PANASONIC CORPORATION 发明人 ARASE HIDEKAZU
分类号 H01L21/50;H01L21/58;H05K3/30;H05K13/00;H05K13/04 主分类号 H01L21/50
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