| 摘要 |
PURPOSE: A method for manufacturing a chip package member is provided to plate contact regions or bonding regions of two chip packages without a masking process once by using a double side film or sheet. CONSTITUTION: Two chip package members(310,320) includes a circuit pattern layer(220) and an insulation layer(210), respectively. The insulation layers of two chip package members are attached to both sides of a first double side adhesive sheet(230), respectively. The contact regions of the circuit pattern layers of two chip package members are plated. The insulation layers are separated from the first double side adhesive sheet. The contact regions of two chip package members are attached to both sides of a second double side adhesive sheet(240). The bonding regions of the circuit pattern layers of two chip package members are plated.
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