发明名称 |
Surface-treated copper foil |
摘要 |
Object is to provide a surface-treated copper foil free from chromium in the surface-treatment layer and excellent in peel strength of a circuit and chemical resistance against to degradation of the peel strength after processing into a printed wiring board. To achieve the object, the surface-treated copper foil having a surface-treatment layer on a bonding surface of a copper foil for manufacturing a copper-clad laminate by laminating it to an insulating resin substrate has the surface-treatment layer formed by depositing a metal component having high melting point not lower than 1400° C. by dry process film formation method to the bonding surface of the copper foil after the cleaning treatment and further depositing a carbon component to the surface. |
申请公布号 |
US8394509(B2) |
申请公布日期 |
2013.03.12 |
申请号 |
US200913002394 |
申请日期 |
2009.06.26 |
申请人 |
NAGATANI SEIJI;WATANABE HIROSHI;IZUMIDA KAZUFUMI;MITSUI MINING & SMELTING CO., LTD. |
发明人 |
NAGATANI SEIJI;WATANABE HIROSHI;IZUMIDA KAZUFUMI |
分类号 |
B32B15/04 |
主分类号 |
B32B15/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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