| 摘要 |
PURPOSE: A die bonding apparatus is provided to reduce die bonding errors by easily separating a chip from a bonding body in a die bonding process. CONSTITUTION: A bonding body(11) includes an air path to inhale or exhale air. Non-adhesive polymer(13) is combined with a bonding body and is formed with a bar shape. One end of the non-adhesive polymer is inserted into the bonding body and the other end of the non-adhesive polymer is extended to the outside of the bonding body. The bonding body includes a chip separating unit to push the semiconductor chip.
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