| 摘要 |
<p>PURPOSE: A light emitting diode package and a manufacturing method thereof are provided to reduce total thickness by directly mounting a light emitting diode chip on a heat radiation substrate. CONSTITUTION: An insulation layer(11a) is formed on a heat radiation substrate(10). A wire pattern layer is formed on the insulation layer. A light emitting diode chip includes an electrode pad. The light emitting diode chip is mounted in a mounting region. A cover layer(13) with an incline is formed in a light emitting diode chip mounting region.</p> |
