发明名称 |
SPUTTERING TARGET, AND METHOD OF MANUFACTURING MAGNETIC MEMORY USING THE SAME |
摘要 |
PURPOSE: A sputtering target and a manufacturing method of a magnetic memory using the same are provided to cheaply prepare a target main body without a screw hole in the target main body. CONSTITUTION: A sputtering target comprises a target main body(10) with a thickness of 3mm or less, containing MgO as main ingredient. The sputtering target is used for a magnetic tunnel junction device. The target main body is supported on a baking plate(12). The thickness(h1) of the target main body and the thickness(h2) of the baking plate satisfy equation1, h1+h2 <= 5mm. The backing plate is made of one among a stainless steel, Al alloy, and W alloy. The external diameter of the target main body and the external diameter of the baking plate satisfy equation 2, T1 >= t2. A hole for mounting a jig is formed near the edge of the upper side of the target main body. The jig fixes the sputtering target at a sputtering device. |
申请公布号 |
KR20130025341(A) |
申请公布日期 |
2013.03.11 |
申请号 |
KR20120095927 |
申请日期 |
2012.08.30 |
申请人 |
UBE MATERIAL INDUSTRIES, LTD.;KABUSHIKI KAISHA TOSHIBA |
发明人 |
KITAGAWA EIJI;DAIBOU TADAOMI;NOMA KENJI;KAI TADASHI;YAMAKAWA KOJI;NAGASE TOSHIHIKO;NISHIYAMA KATSUYA;UEDA KOJI;WATANABE DAISUKE;YODA HIROAKI;SANO SATORU;NISHIMURA YOSHIHIRO;WATANABE TAKAYUKI;KATO YUZO;UEKI AKIRA |
分类号 |
C23C14/35;G11C11/15 |
主分类号 |
C23C14/35 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|