发明名称 SPUTTERING TARGET, AND METHOD OF MANUFACTURING MAGNETIC MEMORY USING THE SAME
摘要 PURPOSE: A sputtering target and a manufacturing method of a magnetic memory using the same are provided to cheaply prepare a target main body without a screw hole in the target main body. CONSTITUTION: A sputtering target comprises a target main body(10) with a thickness of 3mm or less, containing MgO as main ingredient. The sputtering target is used for a magnetic tunnel junction device. The target main body is supported on a baking plate(12). The thickness(h1) of the target main body and the thickness(h2) of the baking plate satisfy equation1, h1+h2 <= 5mm. The backing plate is made of one among a stainless steel, Al alloy, and W alloy. The external diameter of the target main body and the external diameter of the baking plate satisfy equation 2, T1 >= t2. A hole for mounting a jig is formed near the edge of the upper side of the target main body. The jig fixes the sputtering target at a sputtering device.
申请公布号 KR20130025341(A) 申请公布日期 2013.03.11
申请号 KR20120095927 申请日期 2012.08.30
申请人 UBE MATERIAL INDUSTRIES, LTD.;KABUSHIKI KAISHA TOSHIBA 发明人 KITAGAWA EIJI;DAIBOU TADAOMI;NOMA KENJI;KAI TADASHI;YAMAKAWA KOJI;NAGASE TOSHIHIKO;NISHIYAMA KATSUYA;UEDA KOJI;WATANABE DAISUKE;YODA HIROAKI;SANO SATORU;NISHIMURA YOSHIHIRO;WATANABE TAKAYUKI;KATO YUZO;UEKI AKIRA
分类号 C23C14/35;G11C11/15 主分类号 C23C14/35
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