| 摘要 |
PURPOSE: A wafer level camera module is provided to protect a wafer lens and an electronic device from external impacts by fixing a shield can to the wafer through a hitching protrusion formed on the lower side of the shield can to surround a camera. CONSTITUTION: A plurality of wafer lenses(140) are laminated on the upper side of a wafer(110). An image sensor(120) is mounted on the lower side of the wafer and applies an electric signal. An external connection unit(130) is formed on the lower side of the image sensor and is composed of one of a solder ball, a bump, or a pad. A shield can includes a hitching protrusion to be fixed to the wafer. The shield can is made of metal materials to shield electromagnetic waves.
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