ADHESION PROMOTION OF CYANIDE-FREE WHITE BRONZE

摘要

PURPOSE: Adhesion promotion of cyanide-free white bronze is provided to reduce voids frequently generated in a tin/copper layer and copper-containing inter-layer interface even though a plated substrate is exposed to high temperature of 80°C or greater. CONSTITUTION: Adhesion promotion of cyanide-free white bronze comprises; a step for plating one or more metallic layers containing void inhibiting metal adjacent to a copper containing layer; and a step for electrically plating a tin/copper layer adjacent to the one or more metallic layers containing void inhibiting metal in a cyanide-free tin/copper electric bath. [Reference numerals] (AA) White bronze; (BB) Void inhibiting layer; (CC) Copper; (DD) Substrate