发明名称 |
PLASMA REACTOR HAVING DUAL INDUCTIVELY COUPLED PLASMA SOURCE |
摘要 |
PURPOSE: A plasma reactor including a dual induction coupling plasma source is provided to effectively execute a bosh process by uniformly processing a wafer substrate. CONSTITUTION: A plasma reactor(10) includes a plasma reactor body(12) and a dual induction coupling plasma source(20). The plasma reactor includes a substrate processing area and a dielectric window which touches the substrate processing area. The dual induction coupling plasma source includes a first antenna providing a first induced electromotive force for generating plasma in a core area of a substrate processing area through a dielectric window and a second antenna providing a second induced electromotive force for generating the plasma in a boundary area of the substrate processing area. The dual induction coupling plasma source repetitively executes an evaporation process and an engraving process and generates a penetrated silicon path for a processed substrate. [Reference numerals] (42,46,52) Impedance matcher; (60) Vacuum pump |
申请公布号 |
KR20130024453(A) |
申请公布日期 |
2013.03.08 |
申请号 |
KR20110087908 |
申请日期 |
2011.08.31 |
申请人 |
GEN CO., LTD. |
发明人 |
KIM, GYOO DONG;KANG, SUNG YONG;CHOI, DAI KYU |
分类号 |
H05H1/46;H01L21/205;H01L21/3065 |
主分类号 |
H05H1/46 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|