FLEXIBLE CUPPER CLAD LAMINATED FILM FOR SEMI-ADDITIVE AND MANUFACTURING METHOD THE SAME

摘要

PURPOSE: A semi additive flexible copper foil laminated film using the size of a plating particle and the etching ability and a manufacturing method thereof are provided to properly control the size of a plating particle to prevent the undercut caused by the high speed of etching. CONSTITUTION: A polyimide film is treated by plasma. The surface cleaning and the surface roughness are improved. Ni-Cr of a tie layer carrying out a role as a conductor layer and Cu on a seed layer are deposited through a sputtering method of the PVD(physical vapor deposition) method. The Cu layer is plated in the copper sulfate solution by the use of the electrolytic plating method. Cu is electrically plated through several steps based on the is the electric current density.