| 摘要 |
PURPOSE: A plating apparatus is provided to apply a cup type plating method to a rectangular substrate, thereby preventing defects generated by the contamination of a plating solution, and lowering the cost generated by the initial make-up of the plating solution and additive supplementation. CONSTITUTION: A plating apparatus comprises a plating bath, an anode(150), and a cathode. A nozzle for plating solution is formed on the bottom surface of the plating bath. A slit(155) is formed at the anode on the upper side of the nozzle. The cathode is on the upper side of the plating bath. The slit is either longitudinally or transversely formed. An auxiliary slit(145) corresponding to the slit is further formed at an auxiliary panel(140) between the nozzle and the anode. The auxiliary panel is made of either PVC(Poly Vinyl Chloride) or HPVC(Hard Poly Vinyl Chloride). The cathode is at least one shape of elastic pins. A sealing part is further formed at the upper side of the plating bath.
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