LEAD FRAME STRUCTURE FOR SEMICONDUCTOR PACKAGING, MANUFACTURING METHOD OF THE SAME AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE BY USING THE SAME

摘要

PURPOSE: A lead frame structure for a semiconductor package, a manufacturing method thereof, and a method for manufacturing the semiconductor package using the same are provided to prevent a unit substrate from being separated in a semiconductor package manufacturing process by increasing the surface area of a sawing line formed between unit substrates to maximize adhesion with the filled resins. CONSTITUTION: A unit substrate(101) is composed of a conductive base substrate(102) and includes a die pad part(120), a land part(130), a routing part(140), and a first molding part(150). The die pad part supports a semiconductor chip which is mounted. The routing part electrically connects an input and output pad to the land part on the semiconductor chip. A sawing line(110) is formed between the unit substrates with a preset width and a preset depth. The first molding part is filled between the land parts and between sawing lines.