发明名称 LED PACKAGE AND ITS MANUFACTURING METHOD
摘要 <p>PURPOSE: An LED package and a manufacturing method thereof are provided to omit a cap bonding process and to simplify a manufacturing process. CONSTITUTION: A housing(100) includes a leg part(110) and a cover part(120). The cover part is connected to the upper side of the leg part. The cover part includes an opening part(122). The LED(200) is connected to the inner side of the cover part. The LED emits light through the opening part.</p>
申请公布号 KR20130023902(A) 申请公布日期 2013.03.08
申请号 KR20110086998 申请日期 2011.08.30
申请人 INZI MOBILE SOLUTION CO., LTD. 发明人 YOU, JAE IL;LIM, HYUNG YUL
分类号 H01L33/48 主分类号 H01L33/48
代理机构 代理人
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