发明名称 COPPER-BASED SLIDING MATERIAL
摘要 <p>PURPOSE: A copper-based sliding material is provided to improve welding resistance by prevent a direct contact between a surface of a Cu alloy matrix and a surface of an opposite shaft. CONSTITUTION: A copper-based sliding material(1) comprises a steel white metal layer(2) and a Cu alloy layer(3). The Cu alloy layer contains 0.5-15wt% of Sn, 0.2-5wt% of inorganic compound particles, and the rest of Cu and incidental impurities. A mean diameter of the inorganic compound particles is 1-10μm. A true density ratio of a Cu alloy matrix with respect to the inorganic compound particles is 0.6-1.4. A thermal expansion coefficient ratio of the Cu alloy matrix with respect to the inorganic compound particles satisfies 1.5-3.0. A mean distance between the inorganic compound particles dispersed in the Cu alloy matrix is 5-50μm.</p>
申请公布号 KR20130024834(A) 申请公布日期 2013.03.08
申请号 KR20120094816 申请日期 2012.08.29
申请人 DAIDO METAL CO., LTD. 发明人 TUJIMOTO KENTARO;TODA KAZUAKI
分类号 C22C9/00;C22C9/02 主分类号 C22C9/00
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