METHOD FOR SEPARATING SUBSTRATE, AND BONDING SUBSTRATE USING THE SAME AND PRODUCTION METHOD THEREOF

摘要

PURPOSE: A method for separating a substrate, a bonding substrate using the same and a production method thereof are provided to reduce the warpage of a substrate due to ion implantation by using a groove. CONSTITUTION: A groove is formed on a semiconductor substrate(100)(S301). Ions are injected into the semiconductor substrate having the groove to form an ion implantation layer(200)(S302). The semiconductor substrate is separated(S303).