发明名称 ULTRASONIC BONDING APPARATUS HAVING CHANGEABLE PRESSURE PART
摘要 PURPOSE: An ultrasonic bonding device equipped with a replacement type pressurization member is provided to replace a pressurization member based on the shape of the contact plane of bonded object or the overall shape of the bonded object, thereby improving the transmission efficiency of the vibration energy of an ultrasonic horn. CONSTITUTION: A jig base(10) is provided to be vertically movable. The jig base pressurizes the circuit chip of a printed circuit board located on a stage(100). The pressurization member(20) comprises a pressurization plane(20a) pressurizing the circuit chip. An elastic member(30) is combined between the jig base and the pressurization member and provides the elastic force between the pressurization member and the jig base. An ultrasonic horn(40) is combined to the pressurization member in order to deliver vibration through the pressurization plane of the pressurization member to the connected object.
申请公布号 KR20130024426(A) 申请公布日期 2013.03.08
申请号 KR20110087875 申请日期 2011.08.31
申请人 KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY 发明人 YI, SUNG IL;SO, BYOUNG ROK;KIM, KI YOUNG;KANG, CHANG HEON;LEE, SANG JOON
分类号 H05K13/04;B23K1/06;B23K20/10;H05K3/32 主分类号 H05K13/04
代理机构 代理人
主权项
地址